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3DSP develops and provides the only fully configurable DSP cores, configurable at all hardware levels down to the execution unit, instruction level configurable up to the creation of application specific instruction. All DSP cores are scalable and thus software compatible including upward compatibility throughout all core families. The performance of 3DSP's cores matches today's and tomorrow's requirements in such growing segments as broadband communication, audio and multimedia.
3DSP enables fast and easy DSP based SoC design supplying and supporting uni- and multi-core designs, multiple peripherals, microprocessor integration, intelligent bus and DMA controller via its own developed HiFI™ SoC design environment. Our customers have proven their design time has been cut down by a third.
3DSP's DSP solution includes complete suites of software modules for a fast product launch in hot segments such as voice-over-packet (VoP) and Audio.
3DSP is a privately financed company, founded 1997, with 80 employees headquartered in Irvine, CA and facilities in San Jose, CA; Boston, MA; Philadelphia, PA; Munich, Germany; Tokyo, Japan; Seoul, Korea; Taipei, Taiwan.
3DSP Corporation
16271 Laguna Canyon Rd. Irvine, CA 92618, USA
t. 949.435.0600 f. 949.435.0700
Click here to email us
3DSP Taiwan Corporation
3F-3, No.26 Tai Yuen Street Jhubei City, Hsinchu County Taiwan, Republic of China
t. +886.3.552.6288 f. +886.3.552.6289
3DSP Corporation Shanghai Representative Office
8 Dongan Road, Pine City, Suite 727
Xuhui District, Shanghai 200032 Peoples Republic of China
t. +86.21.5496.1963 f. +86.21.5496.0983
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